Diamond-Copper Composite Heat Spreader

Product overview

A diamond-copper composite material option for thermal-management designs where heat spreading and thermal expansion need to be considered together. Define the material architecture and composition target, dimensions and tolerances, surface finish, joining or metallization interface, thermal-conductivity target and measurement conditions. Values should be confirmed for the actual part and test method before comparison or order.

Application areas

Typical project discussions include MEMS, photonics, optoelectronics, advanced packaging, and thermal management.

Specification options

The following details can be reviewed for this product:

• Diamond-copper composite
• Composition or architecture by requirement
• Dimensions and tolerances by drawing
• Thermal conductivity target and test method
• Thermal expansion target if critical
• Surface and interface requirements by agreement

What to include in your inquiry

Please send the required dimensions, material grade or type, tolerance, surface condition, quantity, intended application, and target delivery date. A drawing or inspection checklist is helpful for custom geometries.

Availability and quality confirmation

Custom formulation and geometry; quotation after requirement review Inspection points and document format should be agreed before order confirmation; no unverified stock or certification claim is implied.