Applications

Material selection starts with the device function and process conditions. Use these application summaries to identify a starting material family, then confirm every requirement with the drawing, process flow, and inspection plan.

MATERIAL FAMILY

Silicon carbide (SiC)

Power electronics & EV systems

Substrates for power-device development, epitaxy, and high-voltage or high-temperature designs. Confirm polytype, conductivity, diameter, orientation, thickness, surface finish, and defect limits.

Explore related products

MATERIAL FAMILY

SiC, sapphire, and selected compound substrates

RF, communications & photonics

Material choice depends on frequency, thermal load, device stack, and process compatibility. Confirm substrate type, resistivity or conductivity, crystal orientation, and the intended epitaxial or device process.

Explore related products

MATERIAL FAMILY

Sapphire, ruby, and fused quartz

Optical windows, lasers & metrology

Transparent materials and precision components for optical paths, laser assemblies, inspection systems, and instrumentation. Specify wavelength, transmission needs, geometry, surface quality, flatness, parallelism, and coating requirements.

Explore related products

MATERIAL FAMILY

Fused quartz and sapphire components

Semiconductor process equipment

Tubes, plates, rods, windows, and machined parts can be reviewed for thermal process tools and equipment assemblies. Provide the process environment, temperature, dimensions, interfaces, cleanliness, and inspection requirements.

Explore related products

MATERIAL FAMILY

BF33 glass and sapphire

MEMS, sensors & microfluidics

Glass and sapphire substrates support device development where optical access, thermal behavior, mechanical strength, or bonding interfaces matter. Confirm grade, thickness, surface finish, flatness, edge profile, and any holes or coatings.

Explore related products

MATERIAL FAMILY

Diamond-copper composite and specialty substrates

Advanced packaging & thermal management

Thermal-management materials are specified around heat load, package geometry, interface design, and mechanical constraints. State dimensions, layer or composite architecture, target thermal conductivity, tolerance, test method, and required documentation.

Explore related products

Match a material to your process

Send the target application, geometry, process conditions, critical tolerances, quantity, and delivery timing. We will review the requirements and confirm what can be supplied.

Discuss Your Requirements