Technical articles on material selection, specifications, fabrication, and inspection.
Diamond-copper composites are engineered for thermal management where conductivity, geometry, mechanical behavior, and interface design must be considered together. The material architecture and test conditions should be made…
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BF33 borosilicate glass wafers are considered for projects that need a glass substrate with controlled geometry and a defined process interface. Application suitability depends on the device stack,…
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Fused quartz tubes are used in thermal process equipment where geometry, purity, thermal behavior, and cleanliness must fit the tool and process. A useful RFQ defines the tube…
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Sapphire substrates are used in applications ranging from epitaxy and photonics to optical protection and sensing. The correct specification depends on whether the substrate is serving as a…
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For an epitaxy project, substrate details need to be defined as a coordinated specification. Orientation, off-angle, thickness, surface finish, and defect limits each affect how the wafer fits…
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Silicon carbide wafer selection should begin with the device structure and process flow. A wafer that appears suitable by diameter alone may still differ in polytype, conductivity, orientation,…
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