Semiconductor & Specialty Substrates

BF33 Borosilicate Glass Substrate for MEMS & Optics

BF33 borosilicate glass substrate listed for semiconductor, MEMS, and optical applications. Specify wafer size, thickness, surface finish, edge profile, and bonding or drilling features.

Specification checklist

  • BF33 borosilicate glass listed;Wafer or custom substrate format;Diameter and thickness by drawing;Surface finish and flatness by agreement;Edge profile and TGV / drilling features by drawing;Bonding and process compatibility to confirm

Availability: Custom wafer formats; grade and availability confirmed

Product overview

A BF33 borosilicate glass substrate option for semiconductor, MEMS, sensor, and optical development. The specification should identify substrate format, thickness and tolerance, surface condition, flatness, edge profile, and any bonding, through-glass via, drilling, or coating requirements. Confirm the material grade and process compatibility before sample qualification.

Application areas

Typical project discussions include MEMS, photonics, optoelectronics, advanced packaging, and thermal management.

Specification options

The following details can be reviewed for this product:

  • BF33 borosilicate glass listed
  • Wafer or custom substrate format
  • Diameter and thickness by drawing
  • Surface finish and flatness by agreement
  • Edge profile and TGV / drilling features by drawing
  • Bonding and process compatibility to confirm

What to include in your inquiry

Please send the required dimensions, material grade or type, tolerance, surface condition, quantity, intended application, and target delivery date. A drawing or inspection checklist is helpful for custom geometries.

Availability and quality confirmation

Custom wafer formats; grade and availability confirmed Inspection points and document format should be agreed before order confirmation; no unverified stock or certification claim is implied.

Request a Quote for BF33 Borosilicate Glass Substrate for MEMS & Optics

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